Original Article
Year : 2020 | Volume : 11 | Issue : 3 | Page : 106-111
Comparison of bonding characteristics of a newly introduced light cure adhesive system with conventional adhesive system
Anju Mary Philip, S Babukuttan Pillai, G Sreejith Kumar
Department of Orthodontics and Dentofacial Orthopaedics, Government Dental College, Thiruvananthapuram, Kerala, India
Correspondence Address:
Dr. Anju Mary Philip
Department of Orthodontics and Dentofacial Orthopaedics, Government Dental College, Thiruvananthapuram, Kerala, India.
Abstract:
Background and Objectives:
The purpose of this study was to investigate the effectiveness of newly introduced light cure adhesive system (eXact, TP Orthodontics) with respect to conventionally used adhesive system (Transbond XT, 3M Unitek) by comparing their shear bond strengths and Adhesive Remnant Index after subjecting to thermocycling.
Methods:
Thirty human maxillary first premolars were divided into two groups. Group I (Experimental Group) was bonded with adhesive system eXact and Group II (Control Group) with Transbond XT. After thermocycling, shear bond strengths and adhesive remnants index were compared using SPSS Software. Independent-t test was used to compare the shear bond strength values and Chi-Square Test to compare ARI scores.
Results:
The mean shear bond strength of the Group I and Group II were 9.60±1.41 MPa and 11.65± 2.07 MPa respectively. There was statistically significant difference between the two Groups (P < 0.05). The mean and (±SD) of ARI Scores of Group I and Group II were 2.80 ± 0.414 and 1.93 ± 0.594, respectively, which was statistically significant. The mean ARI score difference of the two adhesives were also statistically significant (P < 0.05).
Conclusion:
The SBS of conventional light cure composite resin (Transbond XT, 3M Unitek) is comparatively higher than the new light-cure composite resin (eXact, TP Orthodontics); but eXact have SBS higher than the clinically acceptable values. ARI score value is higher for eXact as compared to Transbond XT.
Source of Support:
None,
Conflict of Interest:
None
DOI: 10.4103/ijor.ijor_11_20
How to cite this article: Philip AM, Pillai SB, Kumar GS. Comparison of bonding characteristics of a newly introduced light cure adhesive system with conventional adhesive system. Int J Orthod Rehabil 2020;11:106-11.
